Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867887 | Enhanced flow boiling heat transfer in microchannels with structured surfaces | Evelyn N. Wang, Yangying Zhu, Dion S. Antao | 2020-12-15 |
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Liwei Wang +3 more | 2019-11-12 |