Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Kuang-Han Chu, Liwei Wang +3 more | 2019-11-12 | $21,873,000 |
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Jimin Yao, George Kostiew, Shawna M. Liff | 2019-05-21 | $20,944,000 |