Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Two material high K thermal encapsulant system

Two material high K thermal encapsulant system

US Patent 10475715 · Granted Nov 12, 2019

Estimated economic value: $21,873,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die bonding tool with tiltable bond head for improved bonding and methods for pe2025
System and method to integrate microservices in interactive voice response (IVR)2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Systems and methods for suppressing sound leakage2025
Systems and methods for suppressing sound leakage2025
Neural network training method, image classification system, and related device2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Microelectronics package comprising a package-on-package (PoP) architecture with2025
Methods and apparatus to reduce defects in interconnects between semiconductor d2025
Method and system for performing vessel segmentation in a medical image2025
Image classification method, neural network training method, and apparatus2025