Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475715 | Two material high K thermal encapsulant system | Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu, Liwei Wang +3 more | 2019-11-12 |
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2018-06-05 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2017-06-20 |