Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166004 | Solder thermal interface material (STIM) with dopant | Bamidele Daniel Falola, Amitesh Saha, Peng Li | 2024-12-10 |
| 12040246 | Chip-scale package architectures containing a die back side metal and a solder thermal interface material | Malavarayan Sankarasubramanian, Shenavia S. Howell, John Harper, Mitul Modi | 2024-07-16 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Sergio Antonio Chan Arguedas, Peng Li, Amitesh Saha | 2023-11-14 |