Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804420 | Core-shell particles for magnetic packaging | Whitney Bryks | 2023-10-31 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Kristof Darmawikarta, Roy Dittler, Jeremy Ecton, Darko Grujicic | 2023-10-17 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11728077 | Magnetic material having coated ferromagnetic filler particles | Frank Truong, Shivasubramanian Balasubramanian | 2023-08-15 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital +4 more | 2023-08-15 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Aleksandar Aleksov, Georgios Dogiamis, Jeremy Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman | 2023-08-08 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Jeremy Ecton, Andrew J. Brown, Dilan Seneviratne | 2023-06-06 |
| 11652071 | Electronic device package including a capacitor | Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally, Jeremy Ecton | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11462432 | Dual side de-bonding in component carriers using photoablation | Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba | 2022-10-04 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne, Frank Truong | 2022-04-05 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan, Sameer Paital | 2022-01-18 |
| 11158444 | Magnetic material having coated ferromagnetic filler particles | Frank Truong, Shivasubramanian Balasubramanian | 2021-10-26 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2021-08-03 |
| 10923443 | Electronic device package including a capacitor | Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally, Jeremy Ecton | 2021-02-16 |
| 10910327 | Electronic device package with reduced thickness variation | Yonggang Li, Vahidreza Parichehreh, Jeremy Ecton | 2021-02-02 |
| 10546916 | Package-integrated vertical capacitors and methods of assembling same | Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne, Frank Truong | 2020-01-28 |
| 10290557 | Selective metallization of an integrated circuit (IC) substrate | Trina Ghosh Dastidar, Dilan Seneviratne, Yonggang Li, Sirisha Chava | 2019-05-14 |
| 9913603 | Reflowed gold nanostructures for surface enhanced raman spectroscopy | Sameer Walavalkar, Chieh-feng Chang, Axel Scherer, Scott E. Fraser, Andrea Tao | 2018-03-13 |