Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more | 2025-09-23 |
| 12394719 | Methods and apparatus to increase glass core thickness | Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram | 2025-08-19 |
| 12354963 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2025-07-08 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more | 2025-07-01 |
| 12334443 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2025-06-17 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |
| 11923307 | Microelectronic structures including bridges | Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati | 2023-12-05 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Gang Duan +2 more | 2022-12-06 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2022-05-03 |
| 9048632 | Ultrafast laser apparatus | Marcos Dantus | 2015-06-02 |