| 12504581 |
Photonic interconnect and components in glass |
Kristof Darmawikarta, Benjamin Duong, Srinivas V. Pietambaram, Tarek A. Ibrahim, Hari Mahalingam |
2025-12-23 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more |
2025-09-23 |
|
| 12394719 |
Methods and apparatus to increase glass core thickness |
Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram |
2025-08-19 |
|
| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
2025-07-08 |
|
| 12354963 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more |
2025-07-08 |
|
| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more |
2025-07-01 |
|
| 12334443 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more |
2025-06-17 |
|
| 11929330 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more |
2024-03-12 |
$37,196,000 |
| 11923312 |
Patternable die attach materials and processes for patterning |
Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more |
2024-03-05 |
$29,696,000 |
| 11923307 |
Microelectronic structures including bridges |
Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more |
2024-03-05 |
$29,696,000 |
| 11837534 |
Substrate with variable height conductive and dielectric elements |
Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati |
2023-12-05 |
$33,749,000 |
| 11694898 |
Hybrid fine line spacing architecture for bump pitch scaling |
Suddhasattwa Nad, Jeremy Ecton, Rahul N. Manepalli, Marcel Wall |
2023-07-04 |
|
| 11521931 |
Microelectronic structures including bridges |
Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Gang Duan +2 more |
2022-12-06 |
$14,727,000 |
| 11322444 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more |
2022-05-03 |
$16,346,000 |
| 9048632 |
Ultrafast laser apparatus |
Marcos Dantus |
2015-06-02 |
|
