YK

Yosuke Kanaoka

IN Intel: 12 patents #3,417 of 30,777Top 15%
Overall (All Time): #399,811 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12400363 Device and method for improved fiducial marker detection Yi Li, Hong Seung YEON, Nicholas S. Haehn, Wei Li, Raquel DE SOUZA BORGES FERREIRA +4 more 2025-08-26
12087700 Embedded die microelectronic device with molded component Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Dilan Seneviratne 2024-09-10
11923307 Microelectronic structures including bridges Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more 2024-03-05
11923312 Patternable die attach materials and processes for patterning Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Hongxia Feng +10 more 2024-03-05
11527484 Dielectric filler material in conductive material that functions as fiducial for an electronic device Jesse C. Jones, Gang Duan, Jason M. Gamba, Rahul N. Manepalli, Vishal Shajan 2022-12-13
11081448 Embedded die microelectronic device with molded component Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Dilan Seneviratne 2021-08-03
11062933 Die placement and coupling apparatus Jesse C. Jones, Gang Duan, Rahul N. Manepalli 2021-07-13
10847471 Dielectric filler material in conductive material that functions as fiducial for an electronic device Jesse C. Jones, Gang Duan, Jason M. Gamba, Rahul N. Manepalli, Vishal Shajan 2020-11-24
9793233 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby Rajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita 2017-10-17
9472519 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby Rajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita 2016-10-18
9006887 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby Rajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita 2015-04-14
8513792 Package-on-package interconnect stiffener Sanka Ganesan, Ram Viswanath, Rajasekaran Swaminathan, Robert M. Nickerson, Leonel Arana +2 more 2013-08-20