Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10244632 | Solder resist layer structures for terminating de-featured components and methods of making the same | Li-Sheng Weng, Chi-Te Chen, Olivia Chen, Yun Ling | 2019-03-26 |
| 10103105 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2018-10-16 |
| 10020262 | High resolution solder resist material for silicon bridge application | Siddharth K. Alur, Sheng Li | 2018-07-10 |
| 9788416 | Multilayer substrate for semiconductor packaging | Padam Jain, Dilan Seneviratne, Chi-Mon Chen | 2017-10-10 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2017-07-11 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Sairam Agraharam, Amruthavalli Pallavi Alur, Ram Viswanath | 2017-03-21 |
| 9548264 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2017-01-17 |
| 9236366 | High density organic bridge device and method | Mihir K. Roy, Stephanie M. Lotz | 2016-01-12 |
| 7486161 | Reverse-phase cross coupling structure | Chien-Chih Li, Sheng-Feng Yeh | 2009-02-03 |