Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Emad Samadiani, Yingshi Tang, Sue Yun Teng, Nicholas Chao Wei Wong, Kieran Miller +1 more | 2025-09-23 |
| 12315782 | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules | Madhusudan K. Iyengar, Connor Burgess, Emad Samadiani, Jorge Padilla, Feini Zhang +1 more | 2025-05-27 |
| 12272619 | Direct liquid cooling with O-ring sealing | Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Yuan Li, Feini Zhang | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2025-03-04 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2024-05-21 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Xiaojin Wei, Teckgyu Kang +2 more | 2024-04-09 |
| 11721641 | Weight optimized stiffener and sealing structure for direct liquid cooled modules | Madhusudan K. Iyengar, Connor Burgess, Emad Samadiani, Yuan Li | 2023-08-08 |
| 11488890 | Direct liquid cooling with O-ring sealing | Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Yuan Li, Feini Zhang | 2022-11-01 |
| 10964625 | Device and method for direct liquid cooling via metal channels | Yuan Li, Teckgyu Kang, Madhusudan K. Iyengar | 2021-03-30 |
| 9832865 | Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards | Jack Ajoian | 2017-11-28 |
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Dilan Seneviratne, Chi-Mon Chen | 2017-10-10 |