Padam Jain — 11 Patents at Google

Padam Jain has been granted 11 US patents while listed as an inventor at Google. The first was granted in 2017 and the most recent in September 2025. Padam Jain ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Padam Jain in San Jose, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12424509	Compliant pad spacer for three-dimensional integrated circuit package	Emad Samadiani, Yingshi Tang, Sue Yun Teng, Nicholas Chao Wei Wong, Kieran Miller +1 more	2025-09-23
12315782	Spring loaded compliant coolant distribution manifold for direct liquid cooled modules	Madhusudan K. Iyengar, Connor Burgess, Emad Samadiani, Jorge Padilla, Feini Zhang +1 more	2025-05-27
12272619	Direct liquid cooling with O-ring sealing	Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Yuan Li, Feini Zhang	2025-04-08
12243802	Methods and heat distribution devices for thermal management of chip assemblies	Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more	2025-03-04
11990386	Methods and heat distribution devices for thermal management of chip assemblies	Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more	2024-05-21	$161,870,000
11955406	Temperature control element utilized in device die packages	Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Xiaojin Wei, Teckgyu Kang +2 more	2024-04-09	$129,498,000
11721641	Weight optimized stiffener and sealing structure for direct liquid cooled modules	Madhusudan K. Iyengar, Connor Burgess, Emad Samadiani, Yuan Li	2023-08-08	$88,828,000
11488890	Direct liquid cooling with O-ring sealing	Jorge Padilla, Madhusudan K. Iyengar, Connor Burgess, Yuan Li, Feini Zhang	2022-11-01	$86,307,000
10964625	Device and method for direct liquid cooling via metal channels	Yuan Li, Teckgyu Kang, Madhusudan K. Iyengar	2021-03-30	$87,360,000
9832865	Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards	Jack Ajoian	2017-11-28	$110,765,000
9788416	Multilayer substrate for semiconductor packaging	Wei-Lun Kane Jen, Dilan Seneviratne, Chi-Mon Chen	2017-10-10	$9,084,000

Padam Jain — 11 Patents

Patents per Year

Issued Patents All Time

Patent Widget