Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Emad Samadiani, Padam Jain, Yingshi Tang, Nicholas Chao Wei Wong, Kieran Miller +1 more | 2025-09-23 |
| 12243804 | Cooling heatshield for clamshell BGA rework | — | 2025-03-04 |
| 11791231 | Compression-loaded printed circuit assembly for solder defect mitigation | Shinnosuke Yamamoto | 2023-10-17 |
| 11791239 | Cooling heatshield for clamshell BGA rework | — | 2023-10-17 |
| 11183438 | Compression-loaded printed circuit assembly for solder defect mitigation | Shinnosuke Yamamoto | 2021-11-23 |
| 7621190 | Method and apparatus for strain monitoring of printed circuit board assemblies | Mudasir Ahmad | 2009-11-24 |