Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package with passivated interconnects

Package with passivated interconnects

US Patent 10043740 · Granted Aug 7, 2018

Estimated economic value: $25,284,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Photonic interconnect and components in glass2025
Photonic interconnect and components in glass2025
Integrated optical coupler2025
Integrated optical coupler2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Systems and methods for cloud based root service application across multiple coo2025