Issued Patents All Time
Showing 51–66 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017022 | Selective electroless plating for electronic substrates | Houssam Jomaa, Omar J. Bchir | 2011-09-13 |
| 8003479 | Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor | Yongki Min | 2011-08-23 |
| 7998857 | Integrated circuit and process for fabricating thereof | Charan Gurumurthy, Houssam Jomaa, Ravi Tanikella | 2011-08-16 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Ravi Kiran Nalla, Charan Gurumurthy, Hamid Azimi | 2011-07-26 |
| 7981758 | Systems and methods to laminate passives onto substrate | Huankiat Seh, Yongki Min | 2011-07-19 |
| 7951632 | Optical device and method of making | Nathaniel R. Quick, Aravinda Kar | 2011-05-31 |
| 7923059 | Method of enabling selective area plating on a substrate | Omar J. Bchir, Houssam Jomaa, Yonggang Li | 2011-04-12 |
| 7891091 | Method of enabling selective area plating on a substrate | Yonggang Li | 2011-02-22 |
| 7838419 | Systems and methods to laminate passives onto substrate | Huankiat Seh, Yongki Min | 2010-11-23 |
| 7831115 | Optical die structures and associated package substrates | Omar J. Bchir, Charan Gurumurthy, Houssam Jomaa, Ravi Kiran Nalla | 2010-11-09 |
| 7808797 | Microelectronic substrate including embedded components and spacer layer and method of forming same | Huankiat Seh | 2010-10-05 |
| 7765691 | Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate | — | 2010-08-03 |
| 7738257 | Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same | Yongki Min, Huankiat Seh | 2010-06-15 |
| 7583871 | Substrates for optical die structures | Omar J. Bchir, Charan Gurumurthy, Houssam Jomaa, Ravi Kiran Nalla, Yonggang Li | 2009-09-01 |
| 7268063 | Process for fabricating semiconductor component | Nathaniel R. Quick, Aravinda Kar | 2007-09-11 |
| 7237334 | Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate | — | 2007-07-03 |