Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9361059 | Architecture for seamless integrated display system | Johanna M. Swan, Uygar E. Avci, Ravi Pallarisetty | 2016-06-07 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9331017 | Chip package incorporating interfacial adhesion through conductor sputtering | Tao Wu | 2016-05-03 |
| 9266723 | Misalignment correction for embedded microelectronic die applications | Grant A. Crawford | 2016-02-23 |
| 9211609 | Laser via drilling apparatus and methods | Nathaniel R. Quick, Aravinda Kar | 2015-12-15 |
| 9202803 | Laser cavity formation for embedded dies or components in substrate build-up layers | Chong Zhang, Stefanie M. Lotz, Qinglei Zhang, Sri Ranga Sai Boyapati, Nikhil Sharma | 2015-12-01 |
| 9119313 | Package substrate with high density interconnect design to capture conductive features on embedded die | Chong Zhang, Stefanie M. Lotz | 2015-08-25 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2015-07-28 |
| 9064798 | Optical device and method of making | Nathaniel R. Quick, Aravinda Kar | 2015-06-23 |
| 8928151 | Hybrid core through holes and vias | Mihir K. Roy, Yonggang Li | 2015-01-06 |
| 8912549 | Optical device and method of making | Nathaniel R. Quick, Aravinda Kar | 2014-12-16 |
| 8877565 | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method | Yonggang Li, Charan Gurumurthy | 2014-11-04 |
| 8871634 | Chip package incorporating interfacial adhesion through conductor sputtering | Tao Wu | 2014-10-28 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2014-09-16 |
| 8618593 | Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor | Yongki Min | 2013-12-31 |
| 8552564 | Hybrid-core through holes and vias | Mihir K. Roy, Yonggang Li | 2013-10-08 |
| 8450857 | Through mold via polymer block package | Mihir K. Roy, Charavana K. Gurumurthy, Robert L. Sankman | 2013-05-28 |
| 8440916 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Charan Gurumurthy, Hamid Azimi | 2013-05-14 |
| 8372666 | Misalignment correction for embedded microelectronic die applications | Grant A. Crawford | 2013-02-12 |
| 8288682 | Forming micro-vias using a two stage laser drilling process | Yonggang Li | 2012-10-16 |
| 8278214 | Through mold via polymer block package | Mihir K. Roy, Charavana K. Gurumurthy, Robert L. Sankman | 2012-10-02 |
| 8183496 | Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation | Yonggang Li | 2012-05-22 |
| 8094459 | Microelectronic substrate including embedded components and spacer layer and method of forming same | Huankiat Seh | 2012-01-10 |
| 8080836 | Embedded semiconductor component | Nathaniel R. Quick, Aravinda Kar | 2011-12-20 |