Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592202 | Embedding device in substrate cavity | Munehiro Toyama, Toshimi Kohmura | 2009-09-22 |
| 7583871 | Substrates for optical die structures | Omar J. Bchir, Islam A. Salama, Houssam Jomaa, Ravi Kiran Nalla, Yonggang Li | 2009-09-01 |
| 7517788 | System, apparatus, and method for advanced solder bumping | Mengzhi Pang, Christopher Bahr, Ravindra Tanikella | 2009-04-14 |
| 7402515 | Method of forming through-silicon vias with stress buffer collars and resulting devices | Leonel Arana, Devendra Natekar, Michael Newman | 2008-07-22 |
| 7042077 | Integrated circuit package with low modulus layer and capacitor/interposer | Michael Walk, Hamid Azimi, John S. Guzek | 2006-05-09 |
| 7013562 | Method of using micro-contact imprinted features for formation of electrical interconnects for substrates | — | 2006-03-21 |
| 6858475 | Method of forming an integrated circuit substrate | Hamid Azimi, Arthur Lin | 2005-02-22 |