Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291122 | Apparatus with a substrate provided with plasma treatment | Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more | 2022-03-29 |
| 10211143 | Semiconductor device having polyimide layer | — | 2019-02-19 |
| 9484277 | Materials, structures and methods for microelectronic packaging | — | 2016-11-01 |
| 9147603 | Polymer grafting for enhanced dielectric and interconnect material adhesion | Chandramouleeswaran Subramani | 2015-09-29 |
| 8796825 | Materials, structures and methods for microelectronic packaging | — | 2014-08-05 |
| 8530890 | Aligned nanotube bearing composite material | Nachiket R. Raravikar | 2013-09-10 |
| 8222750 | Aligned nanotube bearing composite material | Nachiket R. Raravikar | 2012-07-17 |
| 8129823 | Materials, structures and methods for microelectronic packaging | — | 2012-03-06 |
| 7816487 | Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same | Rahul N. Manepalli | 2010-10-19 |
| 7790598 | System, apparatus, and method for advanced solder bumping | Mengzhi Pang, Christopher Bahr, Charan Gurumurthy | 2010-09-07 |
| 7534648 | Aligned nanotube bearing composite material | Nachiket R. Raravikar | 2009-05-19 |
| 7517788 | System, apparatus, and method for advanced solder bumping | Mengzhi Pang, Christopher Bahr, Charan Gurumurthy | 2009-04-14 |
| 7335608 | Materials, structures and methods for microelectronic packaging | — | 2008-02-26 |