Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908820 | Dual solder methodologies for ultrahigh density first level interconnections | — | 2024-02-20 |
| 11319334 | Site-selective metal plating onto a package dielectric | — | 2022-05-03 |
| 11322469 | Dual solder methodologies for ultrahigh density first level interconnections | — | 2022-05-03 |
| 10073340 | Protein films and methods of forming the same | Vincent M. Rotello, Bradley P. Duncan, Li-Sheng Wang, Eunhee Jeoung, Krishnendu Saha | 2018-09-11 |
| 9147603 | Polymer grafting for enhanced dielectric and interconnect material adhesion | Ravindra Tanikella | 2015-09-29 |