Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7477197 | Package level integration of antenna and RF front-end module | Xiang Yin Zeng, Guizhen Zheng | 2009-01-13 |
| 7432779 | Transmission line impedance matching | Hyunjun Kim, Joong-Ho Kim, Dong-Ho Han | 2008-10-07 |
| 7432592 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Yiqun Bai, Qing Zhou | 2008-10-07 |
| 7417872 | Circuit board with trace configuration for high-speed digital differential signaling | Yuan-Liang Li, Dong Zhong, David G. Figueroa | 2008-08-26 |
| 7373033 | Chip-to-chip optical interconnect | Daoqiang Lu, Jiamiao Tang, Edward A. Zarbock | 2008-05-13 |
| 7352557 | Vertical capacitor apparatus, systems, and methods | Hyunjun Kim, Joong-Ho Kim, Dong-Ho Han | 2008-04-01 |
| 7348678 | Integrated circuit package to provide high-bandwidth communication among multiple dice | Qing Zhou, Wei Shi, Daoqiang Lu | 2008-03-25 |
| 7348661 | Array capacitor apparatuses to filter input/output signal | Hyunjun Kim, Ping Sun, Xiang Yin Zeng | 2008-03-25 |
| 7345359 | Integrated circuit package with chip-side signal connections | Joong-Ho Kim, Dong-Ho Han, Hyunjun Kim | 2008-03-18 |
| 7279391 | Integrated inductors and compliant interconnects for semiconductor packaging | Rockwell Hsu, Sriram Muthukumar | 2007-10-09 |
| 7255573 | Data signal interconnection with reduced crosstalk | BaoShu Xu, Xiang Yin Zeng | 2007-08-14 |
| 7227247 | IC package with signal land pads | Xiang Yin Zeng, BaoShu Xu | 2007-06-05 |
| 7218183 | Transmission line impedance matching | Hyunjun Kim, Joong-Ho Kim, Dong-Ho Han | 2007-05-15 |
| 7209025 | Multilayer inductor with shielding plane | Hyunjun Kim | 2007-04-24 |
| 7205638 | Silicon building blocks in integrated circuit packaging | David G. Figueroa, Dong Zhong, Yuan-Liang Li, Cengiz A. Palanduz | 2007-04-17 |
| 7173803 | Low impedance inter-digital capacitor and method of using | Dong Zhong, Yuan-Liang Li | 2007-02-06 |
| 7145239 | Circuit board with trace configuration for high-speed digital differential signaling | Yuan-Liang Li, Dong Zhong, David G. Figueroa | 2006-12-05 |
| 7142073 | Transmission line impedance matching | Hyunjun Kim, Joong-Ho Kim, Dong-Ho Han | 2006-11-28 |
| 7136272 | Low parasitic inductance capacitor with central terminals | Yuan-Liang Li, Dong Zhong | 2006-11-14 |
| 7123466 | Extended thin film capacitor (TFC) | Ping Sun, Hyunjun Kim, Xiang Yin Zeng | 2006-10-17 |
| 7110263 | Reference slots for signal traces | Joong-Ho Kim, Hyunjun Kim, Dong-Ho Han, Ping Sun | 2006-09-19 |
| 7027289 | Extended thin film capacitor (TFC) | Ping Sun, Hyunjun Kim, Xiang Yin Zeng | 2006-04-11 |
| 6995465 | Silicon building block architecture with flex tape | Dong Zhong, Yuan-Liang Li, Jung Kang | 2006-02-07 |
| 6964584 | Low impedance, high-power socket and method of using | Dong Zhong, Yuan-Liang Li, David G. Figueroa | 2005-11-15 |
| 6914334 | Circuit board with trace configuration for high-speed digital differential signaling | Yuan-Liang Li, Dong Zhong, David G. Figueroa | 2005-07-05 |