Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199085 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2025-01-14 |
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2023-11-14 |
| 11373966 | Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications | Tae Hong Kim, Jiangqi He | 2022-06-28 |
| 11348911 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2022-05-31 |
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2021-09-07 |
| 10700051 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more | 2020-06-30 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2019-04-09 |
| 9594617 | Method and apparatus for positioning crash | Qingping Liu | 2017-03-14 |
| 7659192 | Methods of forming stepped bumps and structures formed thereby | Andrew Yeohi, Sairam Agraharam, Sudarshan Rangaraj | 2010-02-09 |