Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7407085 | Apparatus and method for attaching a semiconductor die to a heat spreader | Jadhav G. Susheel | 2008-08-05 |
| 7393468 | Adhesive with differential optical properties and its application for substrate processing | Eric J. Li | 2008-07-01 |
| 7372120 | Methods and apparatus to optically couple an optoelectronic chip to a waveguide | Steven Towle, Henning Braunisch, Gilroy Vandentop | 2008-05-13 |
| 7373033 | Chip-to-chip optical interconnect | Jiamiao Tang, Jiangqi He, Edward A. Zarbock | 2008-05-13 |
| 7348678 | Integrated circuit package to provide high-bandwidth communication among multiple dice | Qing Zhou, Wei Shi, Jiangqi He | 2008-03-25 |
| 7344383 | Split socket optical interconnect | Andrew C. Alduino, Henning Braunisch | 2008-03-18 |
| 7344318 | Optical interconnect with passive optical alignment | Henning Braunisch, Bram Leader, Mark B. Trobough | 2008-03-18 |
| 7334946 | Passively aligned optical-electrical interface with microlenses | — | 2008-02-26 |
| 7319048 | Electronic assemblies having a low processing temperature | Chuan Hu | 2008-01-15 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents | Tian-An Chen | 2007-12-04 |
| 7288438 | Solder deposition on wafer backside for thin-die thermal interface material | — | 2007-10-30 |
| 7283699 | Optical package | Henning Braunisch, Gilroy Vandentop | 2007-10-16 |
| 7279720 | Large bumps for optical flip chips | Ming Fang, Valery M. Dubin | 2007-10-09 |
| 7279362 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Christopher L. Rumer, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2007-10-09 |
| 7279359 | High performance amine based no-flow underfill materials for flip chip applications | Tian-An Chen | 2007-10-09 |
| 7256059 | Underfill integration for optical packages | Steven Towle | 2007-08-14 |
| 7251389 | Embedded on-die laser source and optical interconnect | Bruce A. Block, Dongming He | 2007-07-31 |
| 7238605 | Circuit structures and methods of forming circuit structures with minimal dielectric constant layers | — | 2007-07-03 |
| 7236666 | On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device | Henning Braunisch, Gilroy Vandentop, Steven Towle | 2007-06-26 |
| 7226812 | Wafer support and release in wafer processing | Steven Towle | 2007-06-05 |
| 7220622 | Method for attaching a semiconductor die to a substrate and heat spreader | Susheel Jadhav | 2007-05-22 |
| 7195941 | Optical devices and methods to construct the same | Gilroy Vandentop | 2007-03-27 |
| 7177504 | Manufacturable connectorization process for optical chip-to-chip interconnects | Steven Towle, Henning Braunisch | 2007-02-13 |
| 7153765 | Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles | Tian-An Chen | 2006-12-26 |
| 7085449 | Waveguide coupling mechanism | Henning Braunisch, Gilroy Vandentop, Steven Towle | 2006-08-01 |