Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7068892 | Passively aligned optical-electrical interface | Henning Braunisch, Edris M. Mohammed, Ian A. Young | 2006-06-27 |
| 7061099 | Microelectronic package having chamber sealed by material including one or more intermetallic compounds | John Heck | 2006-06-13 |
| 7059045 | Method for handling integrated circuit die | Christopher L. Rumer | 2006-06-13 |
| 7045452 | Circuit structures and methods of forming circuit structures with minimal dielectric constant layers | — | 2006-05-16 |
| 7042106 | Underfill integration for optical packages | Steven Towle | 2006-05-09 |
| 7038316 | Bumpless die and heat spreader lid module bonded to bumped die carrier | Chuan Hu, Zhiyong Wang, Gilroy Vandentop | 2006-05-02 |
| 7026376 | Fluxing agent for underfill materials | Tian-An Chen | 2006-04-11 |
| 7023089 | Low temperature packaging apparatus and method | — | 2006-04-04 |
| 7009289 | Fluxless die-to-heat spreader bonding using thermal interface material | Chuan Hu | 2006-03-07 |
| 6933171 | Large bumps for optical flip chips | Ming Fang, Valery M. Dubin | 2005-08-23 |
| 6833289 | Fluxless die-to-heat spreader bonding using thermal interface material | Chuan Hu | 2004-12-21 |
| 6834133 | Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate | Steven Towle | 2004-12-21 |
| 6792179 | Optical thumbtack | Gilroy Vandentop, Steven Towle, Henning Braunisch | 2004-09-14 |
| 6740192 | Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane | Ching-Ping Wong | 2004-05-25 |
| 6344157 | Conductive and resistive materials with electrical stability for use in electronics devices | Chih-Min Cheng, Gerald Fredrickson, Yue Xiao, Quinn K. Tong | 2002-02-05 |