Issued Patents All Time
Showing 26–50 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7767486 | High-volume on-wafer heterogeneous packaging of optical interconnects | Mohammed Edris | 2010-08-03 |
| 7723164 | Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same | Jiangqi He, Xiang Yin Zeng, Jiamiao Tang | 2010-05-25 |
| 7720337 | Wafer based optical interconnect | Henning Braunisch | 2010-05-18 |
| 7713839 | Diamond substrate formation for electronic assemblies | Chuan Hu, Gregory M. Chrysler | 2010-05-11 |
| 7714430 | Substrate with lossy material insert | Xiang Yin Zeng, Jiangqi He, Jiamiao(John) Tang | 2010-05-11 |
| 7703991 | Flip-chip mountable optical connector for chip-to-chip optical interconnectability | Gilroy Vandentop, Henning Braunisch | 2010-04-27 |
| 7682876 | Electronic assemblies having a low processing temperature | Chuan Hu | 2010-03-23 |
| 7684660 | Methods and apparatus to mount a waveguide to a substrate | Henning Braunisch, Nathaniel Arbizu | 2010-03-23 |
| 7675182 | Die warpage control | Hai Sun | 2010-03-09 |
| 7670866 | Multi-die molded substrate integrated circuit device | Haixiao Sun, Aiying Xu | 2010-03-02 |
| 7666714 | Assembly of thin die coreless package | Rajashree Baskaran, Charan Gurumurthy | 2010-02-23 |
| 7659143 | Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same | Jiamiao Tang, Jiangqi He, Xiang Yin Zeng | 2010-02-09 |
| 7626251 | Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same | Chuan Hu, Dongming He | 2009-12-01 |
| 7564066 | Multi-chip assembly with optically coupled die | Qing Zhou, Jiangqi He, Wei Shi, Xiang Yin Zeng | 2009-07-21 |
| 7554203 | Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture | Qing Zhou, Wei Shi, Jiangqi He | 2009-06-30 |
| 7553386 | Adhesive with differential optical properties and its application for substrate processing | Eric J. Li | 2009-06-30 |
| 7538019 | Forming compliant contact pads for semiconductor packages | Qing Zhou, Wei Shi, Jiangqi He | 2009-05-26 |
| 7534715 | Methods including fluxless chip attach processes | Susheel Jadhav, Nitin A. Deshpande | 2009-05-19 |
| 7535689 | Reducing input capacitance of high speed integrated circuits | Xiang Yin Zeng, Ming Dong Cui, Gregory V. Christensen, Mostafa Naguib Abdulla, Jiangqi He +1 more | 2009-05-19 |
| 7518238 | Mounting flexible circuits onto integrated circuit substrates | Henning Braunisch | 2009-04-14 |
| 7507604 | Breakable interconnects and structures formed thereby | Henning Braunisch | 2009-03-24 |
| 7504318 | Nanopowder coating for scribing and structures formed thereby | Eric J. Li, Tian-An Chen | 2009-03-17 |
| 7476568 | Wafer-level assembly of heat spreaders for dual IHS packages | Rajashree Baskaran, Chuan Hu | 2009-01-13 |
| 7435664 | Wafer-level bonding for mechanically reinforced ultra-thin die | John Tang | 2008-10-14 |
| 7432592 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Yiqun Bai, Qing Zhou, Jiangqi He | 2008-10-07 |