Biju Chandran — 22 Patents at Intel

Biju Chandran has been granted 22 US patents while listed as an inventor at Intel. The first was granted in 2001 and the most recent in December 2012. Biju Chandran ranks #189,202 of 4,157,543 US inventors in our database (top 4.6%). Patent records list Biju Chandran in Chandler, AZ, US.

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8324737	Modified chip attach process	Sandeep B. Sane	2012-12-04	$14,359,000
7901982	Modified chip attach process	Sandeep B. Sane	2011-03-08	$15,954,000
7745917	Compliant integrated circuit package substrate	Mitul Modi	2010-06-29	$12,144,000
7691667	Compliant integrated circuit package substrate	Mitul Modi	2010-04-06	$11,081,000
7579213	Modified chip attach process	Sandeep B. Sane	2009-08-25	$20,594,000
7314817	Microelectronic device interconnects	Rajen Dias	2008-01-01
7304391	Modified chip attach process and apparatus	Sandeep B. Sane	2007-12-04	$21,616,000
7235886	Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby	Carlos Gonzalez	2007-06-26	$20,503,000
7202420	Methods to prevent mechanical flexure related BGA failure	—	2007-04-10	$13,767,000
7122403	Method of interconnecting die and substrate	Carlos Gonzalez	2006-10-17	$12,433,000
7078822	Microelectronic device interconnects	Rajen Dias	2006-07-18	$11,508,000
7064014	Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices	Rajen Dias	2006-06-20	$13,743,000
6955947	Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices	Rajen Dias	2005-10-18	$19,273,000
6919224	Modified chip attach process and apparatus	Sandeep B. Sane	2005-07-19	$31,820,000
6812548	Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices	Rajen Dias	2004-11-02	$35,744,000
6790709	Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices	Rajen Dias	2004-09-14	$15,917,000
6752634	Contact array for semiconductor package	Carlos Gonzalez	2004-06-22	$27,859,000
6750549	Variable pad diameter on the land side for improving the co-planarity of ball grid array packages	Carlos Gonzalez	2004-06-15	$34,603,000
6672892	Package retention module coupled directly to a socket	Carlos Gonzalez	2004-01-06	$43,851,000
6600652	Package retention module coupled directly to a socket	Carlos Gonzalez	2003-07-29	$49,479,000
6310773	Heat sink system	Imran Yusuf	2001-10-30	$145,735,000
6256199	Integrated circuit cartridge and method of fabricating the same	Imran Yusuf, Hong Xie, Johnny M. Cook, Jr., Peter Brandenburger, Hamid Ekhlassi	2001-07-03	$161,128,000

Biju Chandran — 22 Patents

Issued Patents All Time

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