Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8324737 | Modified chip attach process | Sandeep B. Sane | 2012-12-04 |
| 7901982 | Modified chip attach process | Sandeep B. Sane | 2011-03-08 |
| 7745917 | Compliant integrated circuit package substrate | Mitul Modi | 2010-06-29 |
| 7691667 | Compliant integrated circuit package substrate | Mitul Modi | 2010-04-06 |
| 7579213 | Modified chip attach process | Sandeep B. Sane | 2009-08-25 |
| 7314817 | Microelectronic device interconnects | Rajen Dias | 2008-01-01 |
| 7304391 | Modified chip attach process and apparatus | Sandeep B. Sane | 2007-12-04 |
| 7235886 | Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby | Carlos Gonzalez | 2007-06-26 |
| 7202420 | Methods to prevent mechanical flexure related BGA failure | — | 2007-04-10 |
| 7122403 | Method of interconnecting die and substrate | Carlos Gonzalez | 2006-10-17 |
| 7078822 | Microelectronic device interconnects | Rajen Dias | 2006-07-18 |
| 7064014 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Rajen Dias | 2006-06-20 |
| 6955947 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Rajen Dias | 2005-10-18 |
| 6919224 | Modified chip attach process and apparatus | Sandeep B. Sane | 2005-07-19 |
| 6812548 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Rajen Dias | 2004-11-02 |
| 6790709 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Rajen Dias | 2004-09-14 |
| 6752634 | Contact array for semiconductor package | Carlos Gonzalez | 2004-06-22 |
| 6750549 | Variable pad diameter on the land side for improving the co-planarity of ball grid array packages | Carlos Gonzalez | 2004-06-15 |
| 6672892 | Package retention module coupled directly to a socket | Carlos Gonzalez | 2004-01-06 |
| 6600652 | Package retention module coupled directly to a socket | Carlos Gonzalez | 2003-07-29 |
| 6310773 | Heat sink system | Imran Yusuf | 2001-10-30 |
| 6256199 | Integrated circuit cartridge and method of fabricating the same | Imran Yusuf, Hong Xie, Johnny M. Cook, Jr., Peter Brandenburger, Hamid Ekhlassi | 2001-07-03 |