BC

Biju Chandran

IN Intel: 22 patents #1,785 of 30,777Top 6%
Overall (All Time): #197,802 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8324737 Modified chip attach process Sandeep B. Sane 2012-12-04
7901982 Modified chip attach process Sandeep B. Sane 2011-03-08
7745917 Compliant integrated circuit package substrate Mitul Modi 2010-06-29
7691667 Compliant integrated circuit package substrate Mitul Modi 2010-04-06
7579213 Modified chip attach process Sandeep B. Sane 2009-08-25
7314817 Microelectronic device interconnects Rajen Dias 2008-01-01
7304391 Modified chip attach process and apparatus Sandeep B. Sane 2007-12-04
7235886 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby Carlos Gonzalez 2007-06-26
7202420 Methods to prevent mechanical flexure related BGA failure — 2007-04-10
7122403 Method of interconnecting die and substrate Carlos Gonzalez 2006-10-17
7078822 Microelectronic device interconnects Rajen Dias 2006-07-18
7064014 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Rajen Dias 2006-06-20
6955947 Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Rajen Dias 2005-10-18
6919224 Modified chip attach process and apparatus Sandeep B. Sane 2005-07-19
6812548 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Rajen Dias 2004-11-02
6790709 Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Rajen Dias 2004-09-14
6752634 Contact array for semiconductor package Carlos Gonzalez 2004-06-22
6750549 Variable pad diameter on the land side for improving the co-planarity of ball grid array packages Carlos Gonzalez 2004-06-15
6672892 Package retention module coupled directly to a socket Carlos Gonzalez 2004-01-06
6600652 Package retention module coupled directly to a socket Carlos Gonzalez 2003-07-29
6310773 Heat sink system Imran Yusuf 2001-10-30
6256199 Integrated circuit cartridge and method of fabricating the same Imran Yusuf, Hong Xie, Johnny M. Cook, Jr., Peter Brandenburger, Hamid Ekhlassi 2001-07-03