Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2018-01-02 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2016-08-09 |
| 7317258 | Thermal interface apparatus, systems, and fabrication methods | Yongmei Liu | 2008-01-08 |
| 7314817 | Microelectronic device interconnects | Biju Chandran | 2008-01-01 |
| 7078822 | Microelectronic device interconnects | Biju Chandran | 2006-07-18 |
| 7064014 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Biju Chandran | 2006-06-20 |
| 7042729 | Thermal interface apparatus, systems, and fabrication methods | Yongmei Liu | 2006-05-09 |
| 6955947 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Biju Chandran | 2005-10-18 |
| 6861285 | Flip chip underfill process | — | 2005-03-01 |
| 6815831 | Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion | — | 2004-11-09 |
| 6812548 | Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices | Biju Chandran | 2004-11-02 |
| 6790709 | Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices | Biju Chandran | 2004-09-14 |