Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979600 | Apparatus and methods for an underfilled integrated circuit package | — | 2005-12-27 |
| 6867978 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Kris Whittenburg, Fay Hua, Carl Deppisch, Sabina J. Houle, Kim Phillippe | 2005-03-15 |
| 6256199 | Integrated circuit cartridge and method of fabricating the same | Imran Yusuf, Hong Xie, Johnny M. Cook, Jr., Biju Chandran, Hamid Ekhlassi | 2001-07-03 |