| 11538753 |
Electronic chip with under-side power block |
MD Altaf Hossain, Ankireddy Nalamalpu, Jin Zhao |
2022-12-27 |
| 11528809 |
Method for orienting solder balls on a BGA device |
MD Altaf Hossain |
2022-12-13 |
| 10980134 |
Method for orienting solder balls on a BGA device |
MD Altaf Hossain |
2021-04-13 |
| 10950537 |
Land side and die side cavities to reduce package z-height |
MD Altaf Hossain |
2021-03-16 |
| 10297542 |
Land side and die side cavities to reduce package z-height |
MD Altaf Hossain |
2019-05-21 |
| 10278292 |
Method for orienting solder balls on a BGA device |
MD Altaf Hossain |
2019-04-30 |
| 9799556 |
Land side and die side cavities to reduce package z-height |
MD Altaf Hossain |
2017-10-24 |
| 9721882 |
Land side and die side cavities to reduce package z-height |
MD Altaf Hossain |
2017-08-01 |
| 9293426 |
Land side and die side cavities to reduce package Z-height |
MD Altaf Hossain |
2016-03-22 |
| 9237659 |
BGA structure using CTF balls in high stress regions |
MD Altaf Hossain |
2016-01-12 |
| 7253523 |
Reworkable thermal interface material |
Ashay Dani, Ajit Sathe, Ravi Prasher |
2007-08-07 |
| 7241147 |
Making electrical connections between a circuit board and an integrated circuit |
Shawn Lloyd, John Oldendorf, Michael Kochanowski |
2007-07-10 |
| 7098534 |
Sacrificial component |
Shawn Lloyd, John Oldendorf, Michael Kochanowski |
2006-08-29 |