Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538753 | Electronic chip with under-side power block | MD Altaf Hossain, Ankireddy Nalamalpu, Jin Zhao | 2022-12-27 |
| 11528809 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2022-12-13 |
| 10980134 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2021-04-13 |
| 10950537 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2021-03-16 |
| 10297542 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2019-05-21 |
| 10278292 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2019-04-30 |
| 9799556 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2017-10-24 |
| 9721882 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2017-08-01 |
| 9293426 | Land side and die side cavities to reduce package Z-height | MD Altaf Hossain | 2016-03-22 |
| 9237659 | BGA structure using CTF balls in high stress regions | MD Altaf Hossain | 2016-01-12 |
| 7253523 | Reworkable thermal interface material | Ashay Dani, Ajit Sathe, Ravi Prasher | 2007-08-07 |
| 7241147 | Making electrical connections between a circuit board and an integrated circuit | Shawn Lloyd, John Oldendorf, Michael Kochanowski | 2007-07-10 |
| 7098534 | Sacrificial component | Shawn Lloyd, John Oldendorf, Michael Kochanowski | 2006-08-29 |