Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9165914 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Mohit Mamodia, Javier Soto Gonzalez, Edward R. Prack | 2015-10-20 | $14,675,000 |
| 7801488 | Interference mitigation by adjustment of interconnect transmission characteristics | Seh Kwa, Alan E. Waltho, Andrew Martwick, Ravid Shmuel | 2010-09-21 | $10,255,000 |
| 7184708 | Interference mitigation by adjustment of interconnect transmission characteristics | Seh Kwa, Alan E. Waltho, Andrew Martwick, Ravid Shmuel | 2007-02-27 | $10,067,000 |