Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1093302 | Foldable wireless charger | Tao Lei | 2025-09-16 |
| D1093303 | Foldable wireless charger | Tao Lei | 2025-09-16 |
| 12394959 | Continuous electrical variable measuring apparatus for power distribution cabinet | Chaobin Hu, Feng Yi | 2025-08-19 |
| D1059946 | Lid with straw | — | 2025-02-04 |
| 12089727 | Ring holder | — | 2024-09-17 |
| 11710646 | Fan-out packaging method and fan-out packaging plate | Chuan Hu, Yingqiang YAN, Yuejin Guo, Yingjun Pi, Edward R. Prack | 2023-07-25 |
| 11692628 | Sealing device for gas-liquid two-phase fluid medium under variable working conditions | Changping Liang, Qiaoping Yue, Feng Yi, Lin-Wei Wang | 2023-07-04 |
| 11555808 | Wide-concentration multi-component hazardous gas detector and implementation method thereof | Jin He, Haidong Guo, Han Zhang, Lun Zhou, Zejiang Zhang | 2023-01-17 |
| 11390801 | Method for preparing bright near-infrared emissive carbon dots with both ultra-narrow full width at half maximum and with two-photon fluorescence | Bai Yang, Kai Zhang, Yunfeng Li | 2022-07-19 |
| 11335664 | Integrated circuit packaging method and integrated packaging circuit | Chuan Hu, Yuejin Guo, Edward R. Prack | 2022-05-17 |
| 11183458 | Integrated circuit packaging structure and method | Chuan Hu, Yuejin Guo, Edward R. Prack | 2021-11-23 |
| 11103460 | Fabrication methods for nanodelivery systems for long term controlled delivery of active pharmaceutical ingredients | Paul S. Ho, Tengfei Jiang, Salomon A. Stavchansky | 2021-08-31 |
| 10930634 | Integrated circuit system and packaging method therefor | Chuan Hu, Yuejin Guo, Edward R. Prack | 2021-02-23 |
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Chuan Hu, Yuejin Guo, Edward R. Prack | 2020-12-15 |
| 10847496 | Chip wiring method and structure | Chuan Hu | 2020-11-24 |
| 10693826 | Message Service | Gautam Pulla, Gary Gilchrist, Rejish Puthiyedath Cheruvatta | 2020-06-23 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Chuan Hu, Yuejin Guo, Edward R. Prack | 2020-04-07 |
| 10347503 | Method and hardware for enhanced removal of post etch polymer and hardmask removal | Ian J. Brown | 2019-07-09 |
| 10264718 | External-leadwire crimping apparatus | Yusheng Ke, Yanping Li, Jiali Wang, Yun Wang, Xinwei Huang | 2019-04-16 |
| 10147640 | Method for removing back-filled pore-filling agent from a cured porous dielectric | — | 2018-12-04 |
| 10068765 | Multi-step system and method for curing a dielectric film | Eric M. Lee, Dorel I. Toma | 2018-09-04 |
| 9443725 | Multi-step system and method for curing a dielectric film | Eric M. Lee, Dorel I. Toma | 2016-09-13 |
| 9184047 | Multi-step system and method for curing a dielectric film | Eric M. Lee, Dorel Toma | 2015-11-10 |
| 9017933 | Method for integrating low-k dielectrics | Dorel I. Toma, Hongyu Yue | 2015-04-28 |
| 8956457 | Thermal processing system for curing dielectric films | Eric M. Lee, Dorel I. Toma | 2015-02-17 |