Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11692628 | Sealing device for gas-liquid two-phase fluid medium under variable working conditions | Changping Liang, Qiaoping Yue, Junjun Liu, Feng Yi | 2023-07-04 |
| 9735039 | Apparatus for separating wafer from carrier | Chien Ling Hwang, Chung-Shi Liu | 2017-08-15 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |
| 9434967 | Microbial culture medium and cultural method | Minsheng Liu, Qian Feng, Zhongzhen Cai | 2016-09-06 |
| 8940618 | Method and device for cutting semiconductor wafers | Chien Ling Hwang, Chung-Shi Liu | 2015-01-27 |
| 8834662 | Apparatus and method of separating wafer from carrier | Chien Ling Hwang, Chung-Shi Liu | 2014-09-16 |
| 8702871 | Package assembly cleaning process using vaporized solvent | Yi-Li Hsiao, Bor-Ping Jang, Kuei-Wei Huang, Chien Ling Hwang, Chung-Shi Liu | 2014-04-22 |
| 8616433 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu | 2013-12-31 |
| 8360303 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu | 2013-01-29 |