Issued Patents All Time
Showing 1–25 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2025-07-22 |
| 12142594 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2024-11-12 |
| 12119238 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2024-03-26 |
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2023-10-03 |
| 11749535 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2023-09-05 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11355471 | System for processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 11101261 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2020-09-29 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10373941 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10109612 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2018-10-23 |
| 9935091 | Package-on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2018-01-30 |