Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865574 | Alignment in the packaging of integrated circuits | Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-10-24 |
| 9786622 | Semiconductor package | Ming-Da Cheng, Chih-Wei Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9673182 | Package on package bonding structure and method for forming the same | Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2017-05-30 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Yu-Feng Chen, Chen-Shien Chen | 2017-03-07 |
| 9583464 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-02-28 |
| 9543185 | Packaging process tools and systems, and packaging methods for semiconductor devices | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-10 |
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Meng-Tse Chen, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9397062 | Package on package bonding structure and method for forming the same | Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-19 |
| 9379032 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Yu-Feng Chen, Chen-Shien Chen | 2016-06-28 |
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2016-06-21 |
| 9343386 | Alignment in the packaging of integrated circuits | Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-17 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin | 2016-02-16 |
| 9218999 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2015-12-22 |
| 9117816 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2015-08-25 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen, Chen-Hua Yu +7 more | 2015-07-14 |
| 9073158 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2015-07-07 |
| 9059148 | Contact structure | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2015-06-16 |
| 8975741 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2015-03-10 |
| 8928134 | Package on package bonding structure and method for forming the same | Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2015-01-06 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Yu-Peng Tsai +6 more | 2015-01-06 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Cheng-Chung Lin, Ai-Tee Ang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |