Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Hao-Jan Pei, Chih-Chiang Tsao, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-03-25 |
| 12144065 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2024-11-12 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Chia-Lun Chang +4 more | 2024-02-13 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |
| 11850531 | Rollable toy car | — | 2023-12-26 |
| 11585992 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2023-02-21 |
| D977582 | Toy car | — | 2023-02-07 |
| 11517064 | Safety helmet inner lining adjustable for suitable wearing | — | 2022-12-06 |
| 11432372 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11158605 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2021-10-26 |
| 11002927 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Chia-Lun Chang +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai | 2020-09-22 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Chia-Lun Chang +4 more | 2020-02-18 |
| 10534353 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, James Hu, Chung-Shi Liu | 2020-01-14 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2019-12-17 |
| 10062659 | System and method for an improved fine pitch joint | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-08-28 |
| 10015888 | Interconnect joint protective layer apparatus and method | Hsuan-Ting Kuo, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |