Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2025-09-16 |
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Shen Cheng, Hao-Jan Pei, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12266673 | Semiconductor package and method of forming the same | Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2025-04-01 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2024-05-28 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11874513 | Package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2023-11-28 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Cheng-Shiuan Wong, Hsiu-Jen Lin +1 more | 2023-05-30 |
| 11585992 | Package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2023-02-21 |
| 11417698 | Semiconductor package and method of forming the same | Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2022-05-24 |
| 11288994 | Source driver and operation method thereof | Ying-Hsiang Wang | 2022-03-29 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh | 2021-09-14 |
| 11002927 | Package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2021-01-26 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10810848 | Electronic device equipped with anti-theft function and method for performing anti-theft management | Chueh-Pin Ko | 2020-10-20 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2020-01-14 |
| 10514728 | Housing for electronic device | Chueh-Pin Ko | 2019-12-24 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10289166 | Housing for electronic device | Chueh-Pin Ko | 2019-05-14 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |