Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2025-09-16 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2025-08-12 |
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Shen Cheng, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2025-07-22 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Cheng-Ting Chen, Chih-Chiang Tsao, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-03-25 |
| 12230597 | Package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2025-02-18 |
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 12107064 | Semiconductor package and manufacturing method thereof | Jen-Jui Yu, Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin +1 more | 2024-10-01 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11942464 | Semiconductor package and method | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2024-02-13 |
| 11862577 | Package structure and method of fabricating the same | Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2024-01-02 |
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2023-10-17 |
| 11721659 | Package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2023-08-08 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2022-04-19 |
| 11211341 | Package structure and method of fabrcating the same | Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2021-09-14 |
| 11069671 | Semiconductor package and method | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2021-06-29 |