Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2020-09-29 |
| 10658323 | Package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-05-19 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2020-02-18 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2020-01-14 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2019-04-30 |
| 9561544 | Methods and devices for safely penetrating materials | Conor J. Walsh, Ajith Thomas, Samuel Kesner, Kechao Xiao, Paul M. Loschak +1 more | 2017-02-07 |
| 9524956 | Integrated fan-out structure and method | Hui-Min Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-12-20 |