Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Lun Chang, Hao-Jan Pei, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Kuei-Wei Huang +3 more | 2025-07-22 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2025-04-01 |
| 12176319 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more | 2024-12-24 |
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2024-07-16 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Kuei-Wei Huang +3 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2024-02-13 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2024-01-16 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +2 more | 2024-01-02 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2023-10-17 |
| 11646293 | Semiconductor structure and method | Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu | 2023-05-09 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more | 2023-03-21 |
| 11585992 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2023-02-21 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11002927 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2021-01-26 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2020-09-29 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2020-02-18 |
| 9929071 | Dicing in wafer level package | An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |