Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2024-05-28 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2023-11-28 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2022-05-24 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Cheng-Ting Chen | 2020-09-22 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2020-01-14 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 9859229 | Package structure and method for forming the same | Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin, Wei-Hung Lin +3 more | 2018-01-02 |
| 9786622 | Semiconductor package | Ming-Da Cheng, Chih-Wei Lin, Kuei-Wei Huang, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Chia-Wei Tu, Ming-Da Cheng, Wen-Hsiung Lu | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-06-13 |
| 9627369 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Wen-Hsiung Lu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9431360 | Semiconductor structure and manufacturing method thereof | Hsuan-Ting Kuo, Wei-Hung Lin, Chun-Lung Jao, Chao-Wen Shih, Ming-Da Cheng +1 more | 2016-08-30 |
| 9385040 | Method of manufacturing a semiconductor device | Tsai-Tsung Tsai, Wen-Hsiung Lu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-05 |
| 9331023 | Device packaging | Ming-Kai Liu, Kai-Chiang Wu, Wei-Hung Lin, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-03 |