Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2016-02-23 |
| 9257321 | Singulation apparatus and method | Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9196559 | Directly sawing wafers covered with liquid molding compound | Wen-Hsiung Lu, Chia-Wei Tu, Ming-Da Cheng, Chung-Shi Liu | 2015-11-24 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Chun-Cheng Lin, Meng-Tse Chen, Chen-Hua Yu +7 more | 2015-07-14 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Chia-Wei Tu, Chung-Shi Liu | 2015-07-14 |
| 9073158 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2015-07-07 |
| 9030022 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2015-05-12 |
| 8987058 | Method for wafer separation | Wen-Hsiung Lu, Cheng-Ting Chen, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2015-03-24 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang +7 more | 2014-11-11 |
| 8853002 | Methods for metal bump die assembly | Hsiu-Jen Lin, Ai-Tee Ang, Yu-Jen Tseng, Ming-Da Cheng, Chung-Shi Liu | 2014-10-07 |
| 8609462 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2013-12-17 |