Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2024-04-16 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2021-06-22 |
| 10319691 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2019-06-11 |
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-12-11 |
| 10008459 | Structures having a tapering curved profile and methods of making same | Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen | 2018-06-26 |
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-03-13 |
| 9673125 | Interconnection structure | Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2017-06-06 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-09 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Chen-Hua Yu, Mirng-Ji Lii, Chen-Shien Chen | 2017-01-03 |
| 9508668 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-29 |
| 9496233 | Interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-15 |
| 9111817 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Tin-Hao Kuo, Chen-Shien Chen | 2015-08-18 |
| 9105530 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2015-08-11 |
| 8853002 | Methods for metal bump die assembly | Hsiu-Jen Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-10-07 |
| 8664041 | Method for designing a package and substrate layout | Guan-Yu Chen, Sheng-Yu Wu, Chen-Hua Yu, Mirng-Ji Lii, Chen-Shien Chen +1 more | 2014-03-04 |