Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12284804 | Memory devices, semiconductor devices, and methods of operations a memory device | Perng-Fei Yuh, Yih Wang, Meng-Sheng Chang, Jui-Che Tsai, Ku-Feng Lin +7 more | 2025-04-22 |
| 12228962 | Clock signal skew calibration apparatus and control method | — | 2025-02-18 |
| 12214849 | Vessel power safety control system and operating method thereof | Bing-Xian Chen, HAN-CHUN KAO, Hung-Hsi Lin, Chung-Ching Lin, Sheng-Hua Chen +2 more | 2025-02-04 |
| 12179336 | Hand tool rack | — | 2024-12-31 |
| 12181523 | Data correction and phase optimization in high-speed receivers | Nanyuan Chen | 2024-12-31 |
| 12176299 | Semiconductor device and manufacturing method thereof | Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin, Shih-Peng Tai +2 more | 2024-12-24 |
| D1040635 | Tool handle | — | 2024-09-03 |
| 11961810 | Solderless interconnection structure and method of forming same | Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2024-04-16 |
| 11953052 | Fastener and housing device including the fastener | Jian-Hua Chen, Po-Tsung Shih, Ming-Hua Ho, Chih-Hao Wu | 2024-04-09 |
| 11903188 | Memory devices, semiconductor devices, and methods of operating a memory device | Perng-Fei Yuh, Yih Wang, Meng-Sheng Chang, Jui-Che Tsai, Ku-Feng Lin +7 more | 2024-02-13 |
| 11736266 | Phase interpolator circuitry for a bit-level mode retimer | Yi-Sheng Lin, Nanyuan Chen | 2023-08-22 |
| 11600319 | Memory system capable of performing a bit partitioning process and an internal computation process | Lih-Yih Chiou, Wei Ling | 2023-03-07 |
| 11587887 | Semiconductor device and manufacturing method thereof | Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin, Shih-Peng Tai +2 more | 2023-02-21 |
| 11575232 | Electrical plug | Shao Hua Li | 2023-02-07 |
| 11489657 | Bit-level mode retimer | Yi-Sheng Lin, Nanyuan Chen | 2022-11-01 |
| 11153982 | Rollable structure and electronic device using same | Ming-Hua Ho, Po-Tsung Shih | 2021-10-19 |
| 11101596 | Waterproof enhanced RF connector | — | 2021-08-24 |
| 11043462 | Solderless interconnection structure and method of forming same | Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2021-06-22 |
| 10879192 | Semiconductor structure and manufacturing method thereof | Hsaing-Pin Kuan, Ching-Hua Hsieh, Chih-Wei Lin, Chun-Cheng Lin, Chun-Yen Lan | 2020-12-29 |
| 10319691 | Solderless interconnection structure and method of forming same | Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2019-06-11 |
| 10128195 | Substrate design with balanced metal and solder resist density | Guan-Yu Chen, Yu-Min Liang, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Chen-Shien Chen, Guan-Yu Chen, Tin-Hao Kuo, Yen-Liang Lin | 2018-08-07 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2018-07-10 |
| 10014870 | Micro-electro-mechanical systems (MEMS), apparatus, and operating methods thereof | Yung-Chow Peng, Wen-Hung Huang | 2018-07-03 |
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-05-08 |