Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176299 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Chih-Wei Lin, Shih-Peng Tai +2 more | 2024-12-24 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Chih-Wei Lin, Shih-Peng Tai +2 more | 2023-02-21 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-12-25 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Chin-Te Wang, Cheng-Hsien Hsieh, Hsien-Wei Chen, Li-Han Hsu, Wei-Cheng Wu +1 more | 2017-11-07 |
| 9524942 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2016-12-20 |