Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2021-06-08 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2019-07-16 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu +1 more | 2018-05-15 |
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Cheng-Hsien Hsieh, Hsien-Wei Chen, Li-Han Hsu, Tzu-Shiun Sheu, Wei-Cheng Wu +1 more | 2017-11-07 |
| 8258606 | High frequency flip chip package structure of polymer substrate | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu | 2012-09-04 |
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Wei-Cheng Wu | 2011-10-11 |