Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8258606 | High frequency flip chip package structure of polymer substrate | Edward Yi Chang, Li-Han Hsu, Wei-Cheng Wu, Chin-Te Wang | 2012-09-04 |
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Wei-Cheng Wu, Chin-Te Wang | 2011-10-11 |