Issued Patents All Time
Showing 25 most recent of 96 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322726 | Method of forming an integrated circuit package having a padding layer on a carrier | Cheng-Hsien Hsieh, Wei-Cheng Wu, Der-Chyang Yeh, Wei-Chih Lai | 2025-06-03 |
| 12320468 | Communication apparatus and bracket device thereof | Lan-Chun Yang, Chun-Hung Huang, Yi-Chieh Lin | 2025-06-03 |
| 12205866 | Semiconductor device | Chien-Chia Chiu | 2025-01-21 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Chien-Fu Tseng | 2025-01-07 |
| 12191224 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2025-01-07 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Meng-Tsan Lee, Tsung-Shu Lin | 2024-04-09 |
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Chien-Fu Tseng | 2023-09-12 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11638360 | Orientation-adjustment mechanism | Lan-Chun Yang, Chun-Hung Huang, Yi-Chieh Lin | 2023-04-25 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2023-03-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |
| 11564487 | Connector for modular rack assembly | — | 2023-01-31 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2022-11-22 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2022-10-11 |
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Meng-Tsan Lee, Tsung-Shu Lin | 2021-12-07 |
| 11069625 | Method for forming package structure | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2021-07-20 |
| 11013318 | Connector for modular rack assembly | — | 2021-05-25 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-05-25 |
| 10971425 | Semiconductor device | Chien-Chia Chiu | 2021-04-06 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2021-03-02 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2020-12-15 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10667604 | Connector for modular rack assembly | — | 2020-06-02 |