Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031376 | Chip package and method of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
| 10879192 | Semiconductor structure and manufacturing method thereof | Ching-Hua Hsieh, Chih-Wei Lin, Chun-Cheng Lin, Yu-Wei Lin, Chun-Yen Lan | 2020-12-29 |