PC

Philip Yu-Shuan Chung

TSMC: 14 patents #2,167 of 12,232Top 20%
Overall (All Time): #335,371 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12417927 Semiconductor device and method of manufacture Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more 2025-09-16
12368149 Methods of forming semiconductor packages Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Kuei-Wei Huang +3 more 2025-07-22
12176319 Reflow method and system Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more 2024-12-24
12040309 Bonding through multi-shot laser reflow Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Kuei-Wei Huang, Yu-Peng Tsai +4 more 2024-07-16
11996400 Manufacturing method of package on package structure Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more 2024-05-28
11942464 Semiconductor package and method Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Kuei-Wei Huang +3 more 2024-03-26
11830746 Semiconductor device and method of manufacture Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more 2023-11-28
11646293 Semiconductor structure and method Chia-Shen Cheng, Wei-Yu Chen, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu 2023-05-09
11610859 Reflow method and system Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more 2023-03-21
11462507 Bonding through multi-shot laser reflow Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Kuei-Wei Huang, Yu-Peng Tsai +4 more 2022-10-04
11342321 Manufacturing method of package on package structure Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more 2022-05-24
11069671 Semiconductor package and method Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Kuei-Wei Huang +3 more 2021-07-20
10790261 Bonding through multi-shot laser reflow Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Kuei-Wei Huang, Yu-Peng Tsai +4 more 2020-09-29
10535644 Manufacturing method of package on package structure Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more 2020-01-14