Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Philip Yu-Shuan Chung +3 more | 2025-09-16 |
| 12261088 | Package structure and method of forming the same | Hao-Jan Pei, Cheng-Ting Chen, Chih-Chiang Tsao, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-03-25 |
| 12107064 | Semiconductor package and manufacturing method thereof | Chih-Chiang Tsao, Hsuan-Ting Kuo, Mao-Yen Chang, Hsiu-Jen Lin, Ching-Hua Hsieh +1 more | 2024-10-01 |
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Chao-Wei Chiu, Hsiu-Jen Lin, Ching-Hua Hsieh | 2024-07-30 |
| 12051655 | Package structure and method of forming the same | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +1 more | 2024-07-30 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2024-01-02 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2023-11-28 |
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Philip Yu-Shuan Chung +3 more | 2023-11-28 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2022-10-25 |
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2021-12-28 |
| 11121089 | Integrated circuit package and method | Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2021-09-14 |