Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368086 | Package structure having thermoelectric cooler | Chao-Wei Li, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12354929 | Package structure and manufacturing method thereof | Kai-Fung Chang, Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Li +2 more | 2025-07-08 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |
| 12051655 | Package structure and method of forming the same | Jen-Jui Yu, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Wei-Yu Chen +1 more | 2024-07-30 |
| 12051639 | Package structure and manufacturing method thereof | Chih-Chiang Tsao, Jen-Jui Yu, Hsiu-Jen Lin, Ching-Hua Hsieh | 2024-07-30 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2023-10-17 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong, Hsiu-Jen Lin +1 more | 2023-05-30 |