Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |
| 12176319 | Reflow method and system | Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2024-12-24 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai +2 more | 2024-03-26 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2024-01-02 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2023-10-17 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Hsiu-Jen Lin +1 more | 2023-05-30 |
| 11610859 | Reflow method and system | Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2021-12-28 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2021-01-26 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |