Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2017-10-24 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9627234 | Method and apparatus for localized and controlled removal of material from a substrate | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9583464 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2017-02-28 |
| 9538582 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2017-01-03 |
| 9437564 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-09-06 |
| 9418955 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chung-Shi Liu, Chen-Hua Yu, Wei-Yu Chen | 2016-08-16 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9373603 | Reflow process and tool | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-06-21 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9263839 | System and method for an improved fine pitch joint | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-02-16 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-01-05 |
| 8987058 | Method for wafer separation | Yu-Peng Tsai, Wen-Hsiung Lu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2015-03-24 |
| 8901726 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |
| 8674496 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2014-03-18 |
| 8629053 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chung-Shi Liu, Chen-Hua Yu, Wei-Yu Chen | 2014-01-14 |
| 8571699 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, James Hu, Chung-Shi Liu | 2013-10-29 |
| 8440503 | Methods for performing reflow in bonding processes | Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2013-05-14 |
| 6692985 | Solar cell substrate with thin film polysilicon | Chorng-Jye Huang, Lee-Ching Kuo, Jyi-Tyan Yeh, Chien-Sheng Huang, Leo C. K. Liau +2 more | 2004-02-17 |
| 6277667 | Method for fabricating solar cells | Chorng-Jye Huang, Chien-Sheng Huang, Lee-Ching Kuo | 2001-08-21 |